Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/30/2011
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Application #:
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12759919
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Filing Dt:
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04/14/2010
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Publication #:
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Pub Dt:
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08/05/2010
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Inventors:
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Shinji Ohuchi, Shigeru Yamada, Yasushi Shiraishi
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Title:
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METHOD OF MAKING SEMICONDUCTOR DEVICE PACKAGED BY SEALING RESIN MEMBER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-12 TORANOMON 1-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| RABIN & BERDO, P.C. |
| 1101 14TH ST., N.W., SUITE 500 |
| WASHINGTON, DC 20005 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 550-1 HIGASHIASAKAWA-CHO, HACHIOJI-SHI |
| TOKYO, JAPAN 193-8550 |
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| RABIN & BERDO, P.C. |
| 1101 14TH ST., N.W., SUITE 500 |
| WASHINGTON, DC 20005 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2-4-8 SHINYOKOHAMA, KOUHOKU-KU |
| YOKOHAMA, JAPAN 222-8575 |
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| RABIN & BERDO, P.C. |
| 1101 14TH ST., N.W., SUITE 500 |
| WASHINGTON, DC 20005 |
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