Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/28/2011
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Application #:
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12320884
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Filing Dt:
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02/06/2009
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Publication #:
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Pub Dt:
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08/12/2010
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Inventors:
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Yoshitaka Sasaki, Hiroyuki Ito, Hiroshi Ikejima, Satoru Sueki, Nobuyuki Okuzawa et al
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Title:
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LAYERED CHIP PACKAGE WITH WIRING ON THE SIDE SURFACES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 678 S. HILLVIEW DR. |
| MILPITAS, CALIFORNIA 95035 |
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| 1-13-1, NIHONBASHI, CHUO-KU |
| TOKYO, JAPAN 103-8272 |
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| SAE TECHNOLOGY CENTRE |
| 6 SCIENCE PARK EAST AVENUE HONG KONG SCIENCE PARK |
| SHATIN, N.T. HONG KONG, CHINA |
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| JAMES A. OLIFF |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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