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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
12676767
Filing Dt:
03/23/2010
Publication #:
Pub Dt:
08/19/2010
Inventor:
Hideyuki Takahashi
Title:
Method of Producing Sintered Compact, Sintered Compact, Sputtering Target Formed from the same, and Sputtering Target-Backing Plate Assembly
Assignment: 1
Reel/Frame:
024127/0763Recorded: 03/24/2010Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/15/2010
Assignee:
10-1, TORANOMON 2-CHOME
MINATO-KU
TOKYO, JAPAN 105-0001
Correspondent:
WILLIAM BAK
501 OFFICE CENTER DRIVE, SUITE 210
FT. WASHINGTON, PA 19034
Assignment: 2
Reel/Frame:
025115/0675Recorded: 10/08/2010Pages: 10
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/01/2010
Assignee:
10-1, TORANOMON 2-CHOME
MINATO-KU
TOKYO, JAPAN 105-0001
Correspondent:
WILLIAM BAK, HOWSON & HOWSON LLP
501 OFFICE CENTER DRIVE
SUITE 210
FORT WASHINGTON, PA 19034
Assignment: 3
Reel/Frame:
025123/0420Recorded: 10/12/2010Pages: 8
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/01/2010
Assignee:
6-3, OTEMACHI 2-CHOME
CHIYODA-KU
TOKYO, JAPAN 100-8164
Correspondent:
WILLIAM BAK, HOWSON & HOWSON LLP
501 OFFICE CENTER DRIVE
SUITE 210
FORT WASHINGTON, PA 19034

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