Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/29/2012
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Application #:
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12656866
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Filing Dt:
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02/18/2010
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Publication #:
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Pub Dt:
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08/26/2010
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Inventors:
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Yoichiro Hamada, Shigeru Hosomomi
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Title:
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MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-3, SHIMBASHI 5-CHOME, MINATO-KU |
| TOKYO 105-8716, JAPAN |
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| JAMES E. ARMSTRONG, IV |
| EDWARDS ANGELL PALMER & DODGE LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-3, SHIMBASHI 5-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8716 |
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| EDWARDS WILDMAN PALMER LLP |
| P.O BOX 55874 |
| BOSTON, MA 02205 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1746-2, OHKUCHI-USHIO |
| ISA-SHI, KAGOSHIMA, JAPAN 895-2501 |
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| LOCKE LORD LLP |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 24, KAIFA RD, NANZIH DISTRICT |
| KAOHSIUNG CITY, TAIWAN 811 |
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| WHDA, LLP |
| 8500 LEESBURG PIKE |
| SUITE 7500 |
| TYSONS CORNER, VA 22182 |
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