Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/19/2015
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Application #:
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12650134
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Filing Dt:
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12/30/2009
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Publication #:
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Pub Dt:
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09/23/2010
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Inventors:
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Byoung Hwa LEE, Sung Kwon Wi, Hae Suk Chung, Dong Seok Park, Min Cheol Park et al
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Title:
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MULTILAYER CHIP CAPACITOR AND METHOD OF FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD ASSIGNOR'S NAME PREVIOUSLY RECORDED ON REEL 023719 FRAME 0262. ASSIGNOR(S) HEREBY CONFIRMS THE THIRD ASSIGNOR'S NAME SHOULD BE LISTED AS CHUNG, HAE SUK.
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| 314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, |
| GYUNGGI-DO, KOREA, REPUBLIC OF |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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