Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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12/04/2012
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Application #:
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12740922
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Filing Dt:
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04/30/2010
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Publication #:
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Pub Dt:
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09/30/2010
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Inventor:
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Behnam Tabrizi
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Title:
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WAFER LEVEL PACKAGING USING FLIP CHIP MOUNTING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20 SYLVAN ROAD |
| WOBURN, MASSACHUSETTS 01801 |
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| SARAH M. GATES |
| ONE MAIN STREET |
| LANDO & ANASTASI, LLP |
| CAMBRIDGE, MA 02142 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20 SYLVAN ROAD |
| WOBURN, MASSACHUSETTS 01801 |
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| ROBERT A. SKRIVANEK, JR. |
| ONE MAIN STREET |
| LANDO & ANASTASI, 11TH FLOOR |
| CAMBRIDGE, MA 02142 |
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Assignment:
3
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ACKNOWLEDGMENT AND ASSIGNMENT
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| 20 SYLVAN ROAD |
| WOBURN, MASSACHUSETTS 01801 |
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| DONALD BOLLELLA |
| 5221 CALIFORNIA AVENUE, 21-1 |
| IRVINE, CA 92617 |
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Assignment:
4
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ACKNOWLEDGMENT AND ASSIGNMENT
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| 20 SYLVAN ROAD |
| WOBURN, MASSACHUSETTS 01801 |
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| DONALD BOLLELLA |
| 5221 CALIFORNIA AVENUE, 21-1 |
| IRVINE, CA 92617 |
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