Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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03/27/2012
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Application #:
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12738995
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Filing Dt:
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04/21/2010
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Publication #:
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Pub Dt:
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10/14/2010
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Inventors:
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Terumasa Moriyama, Kengo Kaminaga
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Title:
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COPPER FOIL FOR PRINTED CIRCUIT BOARD AND COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1, TORANOMON 2-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-0001 |
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| HOWSON & HOWSON LLP |
| 501 OFFICE CENTER DRIVE |
| SUITE 210 |
| FORT WASHINGTON, PA 19034 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 10-1, TORANOMON 2-CHOME |
| MINATO-KU |
| TOKYO, JAPAN 105-0001 |
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| WILLIAM BAK, HOWSON & HOWSON LLP |
| 501 OFFICE CENTER DRIVE |
| SUITE 210 |
| FORT WASHINGTON, PA 19034 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 6-3, OTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8164 |
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| WILLIAM BAK, HOWSON & HOWSON LLP |
| 501 OFFICE CENTER DRIVE |
| SUITE 210 |
| FORT WASHINGTON, PA 19034 |
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