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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/10/2012
Application #:
12799444
Filing Dt:
04/26/2010
Publication #:
Pub Dt:
11/04/2010
Inventor:
James Jen-Ho Wang
Title:
SEMICONDUCTOR BOND PAD PATTERNS AND METHOD OF FORMATION
Assignment: 1
Reel/Frame:
024349/0164Recorded: 04/26/2010Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/21/2010
Assignee:
3131 EAST MUIRWOOD DRIVE
PHOENIX, ARIZONA 85048
Correspondent:
JAMES JEN-HO WANG
3131 EAST MUIRWOOD DRIVE
PHONEIX, ARIZONA 85048

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