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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12779527
Filing Dt:
05/13/2010
Publication #:
Pub Dt:
12/09/2010
Inventor:
Tomohiro Murakami
Title:
Semiconductor Device Having Leadframe With Lead-Free Plating For Improving Resistance To Whisker Formation
Assignment: 1
Reel/Frame:
024382/0091Recorded: 05/13/2010Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/06/2010
Assignee:
1753, SHIMONUMABE, NAKAHARA-KU
KAWASAKI-SHI
KANAGAWA, JAPAN 211-8668
Correspondent:
WOMBLE CARLYLE SANDRIDGE & RICE, PLLC
ATTN: PATENT DOCKETING
P.O. BOX 7037
ATLANTA, GA 30357-0037

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