Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/18/2014
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Application #:
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12483529
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Filing Dt:
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06/12/2009
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Publication #:
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Pub Dt:
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12/16/2010
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Inventors:
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Sun Kuen WONG, Hon Chiu HUI, Yin Fun NG
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Title:
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DIE BONDER PROVIDING A LARGE BONDING FORCE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20/F., WATSON CENTRE |
| 16-22 KUNG YIP ST. |
| KWAI CHUNG, HONG KONG |
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| OSTROLENK FABER LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 100368403 |
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