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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12801594
Filing Dt:
06/16/2010
Publication #:
Pub Dt:
12/23/2010
Inventor:
Masashi Yoshida
Title:
Method of etching the back side of a wafer
Assignment: 1
Reel/Frame:
024608/0845Recorded: 06/16/2010Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/19/2009
Assignee:
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI
TOKYO, JAPAN 193-8550
Correspondent:
ROBERT H. BERDO, JR.
RABIN & BERDO, PC
1101 14TH ST., NW
SUITE 500
WASHINGTON, DC 20005

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