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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12802626
Filing Dt:
06/09/2010
Publication #:
Pub Dt:
12/30/2010
Inventor:
Hideaki Korai
Title:
Adhesive compositions containing bond-strength enhancing agent and methods for producing woody board using adhesive compositions
Assignment: 1
Reel/Frame:
024737/0449Recorded: 06/09/2010Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/24/2010
Assignee:
NO. 1, MATSUNOSATO
TSUKUBA-SHI, IBARAKI-KEN, JAPAN 305-8687
Correspondent:
DOUGLAS M. MCALLISTER
LIPSITZ & MCALLISTER, LLC
755 MAIN STREET, BLDG. NO. 8
MONROE, CONNECTICUT 06468

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