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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12458037
Filing Dt:
06/30/2009
Publication #:
Pub Dt:
12/30/2010
Inventors:
Shui-Hsu Hung, Chien-Wei Lee, Shih-Wei Lee
Title:
Plane-type heat-dissipating structure with high heat-dissipating effect and method for manufacturing the same
Assignment: 1
Reel/Frame:
022948/0768Recorded: 07/13/2009Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/28/2009
Exec Dt:
04/28/2009
Exec Dt:
04/28/2009
Assignee:
NO. 398, RENAI STREET, YUNGKANG CITY
TAINAN, TAIWAN R.O.C.
Correspondent:
MORTON J. ROSENBERG, ESQ.
ROSENBERG, KLEIN & LEE
3458 ELLICOTT CENTER DRIVE, SUITE 101
ELLICOTT CITY, MARYLAND 21043

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