Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12818542
|
Filing Dt:
|
06/18/2010
|
|
Publication #:
|
|
Pub Dt:
|
12/30/2010
| | | | |
|
Inventors:
|
Hisao Tanaka, Satoshi Emoto, Takumi Masuyama, Kenichi Nashirozawa, Nana Matsushima
|
|
Title:
|
SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDER BONDING METHOD
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, |
| KAWASAKI-SHI, KANAGAWA, JAPAN 211-8588 |
|
|
|
|
| KRATZ, QUINTOS & HANSON, LLP |
| 4TH FLOOR 1420 K STREET, N.W. |
| WASHINGTON, DC 20005 |
|
|
Search Results as of:
05/03/2024 04:01 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
