Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/24/2012
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Application #:
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12459007
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Filing Dt:
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06/24/2009
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Publication #:
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Pub Dt:
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12/30/2010
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Inventors:
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Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz et al
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Title:
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MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BLVD. |
SANTA CLARA, CALIFORNIA 95052 |
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INTEL CORPORATION, C/O CPA GLOBAL |
PO BOX 52050 |
MINNEAPOLIS, MN 55402 |
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