Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12882324
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Filing Dt:
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09/15/2010
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Publication #:
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Pub Dt:
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01/06/2011
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Inventor:
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Cheng-Tang HUANG
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Title:
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METHOD OF DIE REARRANGEMENT PACKAGE STRUCTURE HAVING PATTERNED UNDER BUMP METALLURGIC LAYER CONNECTING METAL LEAD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1, R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON, BERMUDA HM 12 |
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| SINORICA, LLC |
| 2275 RESEARCH BLVD. |
| SUITE 500 |
| ROCKVILLE, MD 20850 |
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