Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12585996
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Filing Dt:
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09/30/2009
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Publication #:
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Pub Dt:
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02/03/2011
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Inventors:
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Jin-Chang Wu, Wen-bing Wang, Xun Wang
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Title:
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Ball grid array printed circuit board, package structure, and fabricating method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 188, WEN HWA 2ND RD., KUEI SHAN HSIANG |
| TAO YUAN SHIEN, TAIWAN R.O.C. |
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| NO. 2, LN. 58, SAN-ZHUANG RD. |
| SONGJIANG EPZ SHANGHAI, CHINA |
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| ROBERT H. BERDO, JR. |
| RABIN & BERDO, PC |
| 1101 14TH STREET, NW |
| SUITE 500 |
| WASHINGTON, DC 20005 |
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