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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/29/2014
Application #:
12688158
Filing Dt:
01/15/2010
Publication #:
Pub Dt:
02/10/2011
Inventor:
Kenneth J. Huening
Title:
METHOD OF FORMING SOLDERABLE SIDE-SURFACE TERMINALS OF QUAD NO-LEAD FRAME (QFN) INTEGRATED CIRCUIT PACKAGES
Assignment: 1
Reel/Frame:
023795/0614Recorded: 01/15/2010Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/14/2010
Assignee:
120 SAN GABRIEL DRIVE
SUNNYVALE, CALIFORNIA 94086
Correspondent:
FOUNTAIN LAW GROUP, PLC C/O MAXIM
18201 VON KARMAN AVE
SUITE 960
IRVINE, CA 92612

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