Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12554087
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Filing Dt:
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09/04/2009
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Publication #:
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Pub Dt:
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03/10/2011
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Inventor:
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Wen Hung Hu
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Title:
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PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN ROAD, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| PETER F. CORLESS |
| P.O. BOX 55874 |
| BOSTON, MA 02205 |
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