Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/03/2014
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Application #:
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12805591
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Filing Dt:
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08/06/2010
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Publication #:
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Pub Dt:
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03/10/2011
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Inventors:
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Akira Ueda, Junichi Ishimine, Ikuro Nagamatsu, Tadashi Katsui, Seiichi Saito et al
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Title:
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Thermal-fluid-simulation analyzing apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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| STAAS & HALSEY LLP |
| ATTENTION: MARK J. HENRY |
| 1201 NEW YORK AVE., N.W., SUITE 700 |
| WASHINGTON, D.C. 20005 |
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