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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/01/2012
Application #:
12927637
Filing Dt:
11/18/2010
Publication #:
Pub Dt:
03/31/2011
Inventors:
Ming Sun, Yueh Se Ho
Title:
PACKAGING CONFIGURATIONS FOR VERTICAL ELECTRONIC DEVICES USING CONDUCTIVE TRACES DISPOSED ON LAMINATED BOARD LAYERS
Assignment: 1
Reel/Frame:
027857/0437Recorded: 03/13/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/2011
Exec Dt:
01/24/2011
Assignee:
475 OAKMEAD PKWY
SUNNYVALE, CALIFORNIA 94085
Correspondent:
BO-IN LIN
13445 MANDOLI DRIVE
LOS ALTOS HILLS, CA 94022

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