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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	NONE	Issue Dt:		Application #:	12694926	Filing Dt:	01/27/2010
Publication #:	20110085277	Pub Dt:	04/14/2011
Inventors:	Kang Heon HUR, Eun Hyuk Chae, Sung Kwon Wi, Doo Young Kim, Dong Seok Park, Byoung Hwa Lee et al
Title:	MULTILAYER CHIP CAPACITOR

Assignment: 1

Reel/Frame:

023859/0361

Recorded: 01/27/2010

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

HUR, KANG HEON

Exec Dt:

12/21/2009

CHAE, EUN HYUK

Exec Dt:

12/21/2009

WI, SUNG KWON

Exec Dt:

12/21/2009

KIM, DOO YOUNG

Exec Dt:

12/21/2009

PARK, DONG SEOK

Exec Dt:

12/23/2009

LEE, BYOUNG HWA

Exec Dt:

12/21/2009

PARK, SANG SOO

Exec Dt:

12/22/2009

PARK, MIN CHEOL

Exec Dt:

12/21/2009

CHUNG, HAE SUK

Exec Dt:

12/21/2009

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD.

314 MAETAN 3-DONG, YEONGTONG-GU

SUWON, GYUNGGI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF

Correspondent:

MCDERMOTT WILL & EMERY LLP

600 13TH STREET, N.W.

WASHINGTON, DC 20005-3096

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