Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12748082
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Filing Dt:
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03/26/2010
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Publication #:
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Pub Dt:
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05/12/2011
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Inventors:
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Ji-Eun KIM, Nam-Keun Oh, Jung-Hyun Park, Young-Ji Kim, Jong-Gyu Choi, Sang-Duck Kim et al
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Title:
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BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314, MAETAN3-DONG, YEONGTONG-GU, SUWON, |
| GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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