Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/03/2013
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Application #:
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13054251
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Filing Dt:
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01/14/2011
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Publication #:
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Pub Dt:
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05/19/2011
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Inventors:
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Takao Yamazaki, Masahiko Sano, Seiji Kurashina, Yoshimichi Sogawa
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Title:
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ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ENCAPSULATING PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| KEN SATO |
| 6535 N. STATE HWY 161 |
| IRVING, TX 75039 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11TH FLOOR, DSM JIMBOCHO BUILDING, 1-11, KANDA JIMBOCHO, CHIYODA-KU |
| TOKYO, JAPAN 101-0051 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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