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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/24/2013
Application #:
12888781
Filing Dt:
09/23/2010
Publication #:
Pub Dt:
05/26/2011
Inventors:
Dirk Siepe, Thomas Gutt, Roman Roth
Title:
BONDING CONNECTION BETWEEN A BONDING WIRE AND A POWER SEMICONDUCTOR CHIP
Assignment: 1
Reel/Frame:
025796/0806Recorded: 02/11/2011Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/27/2010
Exec Dt:
09/22/2010
Exec Dt:
02/11/2011
Assignee:
AM CAMPEON 1-12
NEUBIBERG, GERMANY 85579
Correspondent:
COATS & BENNETT, PLLC
1400 CRESCENT GREEN
SUITE 300
CARY, NC 27518

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