Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/01/2013
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Application #:
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12935864
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Filing Dt:
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12/21/2010
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Publication #:
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Pub Dt:
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06/02/2011
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Inventors:
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Hideki Mizuhara, Hajime Kobayashi, Toshiya Shimizu
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Title:
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SOLDER STRUCTURE, METHOD FOR FORMING THE SOLDER STRUCTURE, AND SEMICONDUCTOR MODULE INCLUDING THE SOLDER STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-5, KEIHAN-HONDORI 2-CHOME, MORIGUCHI CITY |
| OSAKA, JAPAN 570-8677 |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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