Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12642020
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Filing Dt:
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12/18/2009
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Publication #:
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Pub Dt:
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06/23/2011
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Inventors:
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Richard A. Quackenbush, James Su, John T. Wilson
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Title:
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Multi-tiered Circuit Board and Method of Manufacture
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| IBM - INTELLECTUAL PROPERTY LAW |
| ARMONK, NEW YORK 10504 |
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| STEVEN L. BENNETT |
| 11501 BURNET ROAD |
| IBM - INTELLECTUAL PROPERTY LAW |
| AUSTIN, TX 78758 |
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