Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12640946
|
Filing Dt:
|
12/17/2009
|
Publication #:
|
|
Pub Dt:
|
06/23/2011
| | | | |
Inventors:
|
Peng Sun, Chi Kuen Vincent Leung, Xun Qing Shi
|
Title:
|
Module for Use in a Multi Package Assembly and a Method of Making the Module and the Multi Package Assembly
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
3RD FLOOR, BIO-INFORMATICS CENTRE, 2 SCIENCE PARK WEST AVENUE |
HONG KONG SCIENCE PARK |
SHATIN, N.T., HONG KONG |
|
|
|
CHRISTOPHER P. HARRIS |
TAROLLI, SUNDHEIM, COVELL & TUMMNIO LLP |
1300 EAST NINTH STREET, SUITE 1700 |
CLEVELAND, OH 44114 |
|
|
Search Results as of:
05/14/2024 05:40 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|