Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/29/2014
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Application #:
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12979474
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Filing Dt:
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12/28/2010
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Publication #:
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Pub Dt:
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06/30/2011
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Inventors:
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Shinnosuke MAEDA, Tetsuo SUZUKI, Takuya HANDO, Atsuhiko SUGIMOTO, Satoshi HIRANO et al
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Title:
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Method of Manufacturing Multilayer Wiring Substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-18, TAKATSUJI-CHO, MIZUHO-KU |
| NAGOYA-SHI, AICHI, JAPAN 467-8525 |
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| STITES & HARBISON PLLC |
| 1199 NORTH FAIRFAX STREET |
| SUITE 900 |
| ALEXANDRIA, VA 22314 |
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