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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12975360
Filing Dt:
12/22/2010
Publication #:
Pub Dt:
06/30/2011
Inventors:
SHYH-MING CHEN, Xiang Lin You
Title:
ASSEMBLY OF HEAT DISSIPATING MODULE
Assignment: 1
Reel/Frame:
025956/0489Recorded: 03/15/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/15/2010
Exec Dt:
12/15/2010
Assignee:
NO.481, ZHONGZHENG 1ST RD.
YINGGE TOWNSHIP
TAIPEI COUNTY 239, TAIWAN (R.O.C.)
Correspondent:
SHYH-MING CHEN
235 CHUNG-HO BOX 8-24
TAIPEI TAIWAN R.O.C.

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