Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/10/2012
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Application #:
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12834125
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Filing Dt:
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07/12/2010
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Publication #:
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Pub Dt:
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07/07/2011
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Inventor:
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James L. Voelz
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Title:
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METHODS FOR WAFER-LEVEL PACKAGING OF MICROELECTRONIC DEVICES AND MICROELECTRONIC DEVICES FORMED BY SUCH METHODS
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Assignment:
1
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STATEMENT UNDER 3.73(B) & POWER OF ATTORNEY
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26 DEER CREEK LANE |
MOUNT KISCO, NEW YORK 10549 |
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RICHARD J. BOTOS |
LERNER, DAVID, LITTENBERG, ET AL |
600 SOUTH AVENUE WEST |
WESTFIELD, NJ 07090 |
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