Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/23/2014
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Application #:
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13004873
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Filing Dt:
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01/11/2011
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Publication #:
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Pub Dt:
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07/14/2011
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Inventor:
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Hyung-Rak Lee
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Title:
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Wafer Polishing Apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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274, IMSU-DONG |
GUMI-SI |
GYEONGBUK, KOREA, REPUBLIC OF 730-350 |
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COLBY B. SPRINGER |
CARR & FERRELL LLP |
120 CONSTITUTION DRIVE |
MENLO PARK, CA 94025 |
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