Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/09/2016
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Application #:
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13005838
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Filing Dt:
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01/13/2011
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Publication #:
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Pub Dt:
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07/28/2011
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Inventors:
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Tsutomu YASUI, Hisayuki ABE, Kenichi KAWABATA, Tomoko KITAMURA
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Title:
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LEAD-FREE SOLDER AND ELECTRONIC COMPONENT BUILT-IN MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-13-1, NIHONBASHI |
CHUO-KU, TOKYO, JAPAN 103-8272 |
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JAMES A. OLIFF |
OLIFF & BERRIDGE, PLC |
P.O. BOX 320850 |
ALEXANDRIA, VA 22320-4850 |
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Assignment:
2
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3-9-1, SHIBAURA, MINATO-KU |
TOKYO 108-0023, JAPAN |
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JAMES A. OLIFF |
OLIFF & BERRIDGE, PLC |
P.O. BOX 19928 |
ALEXANDRIA, VA 22320 |
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