Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2011
|
Application #:
|
12694012
|
Filing Dt:
|
01/26/2010
|
|
Publication #:
|
|
Pub Dt:
|
07/28/2011
| | | | |
|
Inventors:
|
Yoshimi Takahashi, Masood Murtuza, Rajiv Dunne, Satyendra Singh Chauhan
|
|
Title:
|
DUAL CARRIER FOR JOINING IC DIE OR WAFERS TO TSV WAFERS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 7839 CHURCHILL WAY, M/S 3999 |
| DALLAS, TEXAS US 75251 |
|
|
|
|
| TEXAS INSTRUMENTS INCORPORATED |
| 7839 CHURCHILL WAY, M/S 3999 |
| DALLAS, TX 75251 |
|
|
Search Results as of:
05/07/2024 07:51 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
