Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/06/2012
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Application #:
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13094780
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Filing Dt:
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04/26/2011
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Publication #:
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Pub Dt:
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08/18/2011
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Inventors:
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Mou-Shiung Lin, Huei-Mei Yen, Chiu-Ming Chou, Hsin-Jung Lo, Ke-Hung Chen
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Title:
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SEMICONDUCTOR CHIP WITH A BONDING PAD HAVING CONTACT AND TEST AREAS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ROOM 301/302, NO. 47, PARK 2ND RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| MCDERMOTT WILL & EMERY LLP |
| 18191 VON KARMAN AVENUE |
| SUITE 500 |
| IRVINE, CA 92612-7108 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121-1714 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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