Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/17/2013
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Application #:
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13124712
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Filing Dt:
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04/18/2011
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Publication #:
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Pub Dt:
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08/18/2011
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Inventor:
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Andrew Holland
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Title:
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A WAFER LEVEL CHIP SCALE PACKAGE WITHOUT AN ENCAPSULATED VIA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| COWLEY ROAD |
| CHURCHILL HOUSE, CAMBRIDGE BUSINESS PARK |
| CAMBRIDGE, UNITED KINGDOM CB4 0WZ |
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| GARY R. JAROSIK |
| 77 W. WACKER DRIVE |
| GREENBERG TRAURIG, LLP - SUITE 3100 |
| CHICAGO, IL 60601-1732 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| CHURCHILL HOUSE CAMBRIDGE BUSINESS PARK COWLEY ROAD |
| CAMBRIDGE, UNITED KINGDOM CB4 0WZ |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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