Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/05/2014
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Application #:
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13036074
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Filing Dt:
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02/28/2011
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Publication #:
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Pub Dt:
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09/01/2011
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Inventors:
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Shu Chuen HO, Si Liang LU, Swee Kwong MOK, Kar Weng YAN
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Title:
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APPARATUS FOR MOLDING ELECTRONIC COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7, |
| SINGAPORE, SINGAPORE 76824 |
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| OSTROLENK FABER LLP |
| 1180 AVENUE OF THE AMERICAS |
| 7TH FLOOR |
| NEW YORK, NY 10036 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S ADDRESS. THE ASSIGNEE'S ADDRESS SHOULD BE 2 YISHUN AVENUE 7, SINGAPORE, SINGAPORE 768924 PREVIOUSLY RECORDED ON REEL 026075 FRAME 0069. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 2 YISHUN AVENUE 7, |
| SINGAPORE 768924, SINGAPORE |
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| OSTROLENK FABER LLP |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| CPA GLOBAL |
| CASTLE STREET , LIBERATION HOUSE |
| ST HELIER, JERSEY, JE1 1BL JERSEY |
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