Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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09/23/2014
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Application #:
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12980675
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Filing Dt:
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12/29/2010
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Publication #:
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Pub Dt:
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09/08/2011
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Inventors:
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Kenji MIYAKOSHI, Shinichiro Wada, Keigo Kitazawa, Yohei Yanagida, Takayuki Oshima
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Title:
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Semiconductor Device and Its Manufacturing Method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-6, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN |
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| CROWELL & MORING LLP |
| P.O. BOX 14300 |
| WASHINGTON, DC 20044-4300 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, NAKASE 1-CHOME |
| MIHAMA-KU, CHIBA-SHI, CHIBA, JAPAN 261-8507 |
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| CROWELL & MORING LLP |
| P.O. BOX 14300 |
| WASHINGTON, DC 20044-4300 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 8, NAKASE 1-CHOME, MIHAMA-KU |
| CHIBA-SHI, CHIBA, JAPAN 261-8507 |
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| TADASHI HORIE/KOH HINOKAWA |
| P.O. BOX 10395 |
| CHICAGO, IL 60610 |
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Assignment:
4
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| 4106-73 OAZA MIYOTA, MIYOTA-MACHI |
| KITASAKU-GUN, |
| NAGANO, JAPAN |
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| TADASHI HORIE |
| CROWELL & MORING LLP |
| PO BOX 10395 |
| CHICAGO, IL 60610 |
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