Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/08/2013
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Application #:
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12720532
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Filing Dt:
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03/09/2010
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Publication #:
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Pub Dt:
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09/15/2011
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Inventors:
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Weiping Liu, Ning-Cheng Lee
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Title:
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COMPOSITE SOLDER ALLOY PREFORM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 34 ROBINSON ROAD |
| CLINTON, NEW YORK 13323 |
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| SHEPPARD, MULLIN, RICHTER & HAMPTON LLP |
| 333 SOUTH HOPE STREET |
| 48TH FLOOR |
| LOS ANGELES, CA 90071-1448 |
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