Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13119694
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Filing Dt:
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05/26/2011
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Publication #:
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Pub Dt:
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09/15/2011
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Inventors:
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Toyohiko Fujisawa, Daesup Hyun, Junji Nakanishi
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Title:
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Liquid Die Bonding Agent
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 159-1, SAMSUNG-DONG, KANGNAM-KU |
| SEOUL, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF 135729 |
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| DAVID M. LAPRAIRIE |
| 450 W. FOURTH STREET |
| HOWARD & HOWARD ATTORNEYS PLLC |
| ROYAL OAK, MI 48067-2557 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, OTEMACHI 1-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-0004 |
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| DAVID M. LAPRAIRIE |
| 450 W. FOURTH STREET |
| HOWARD & HOWARD ATTORNEYS PLLC |
| ROYAL OAK, MI 48067-2557 |
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