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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/18/2015
Application #:
12725754
Filing Dt:
03/17/2010
Publication #:
Pub Dt:
09/22/2011
Inventors:
Eugene M. Chow, Philipp H. Schmaelzle
Title:
ALIGNMENT STRUCTURES FOR INTEGRATED-CIRCUIT PACKAGING
Assignment: 1
Reel/Frame:
024459/0448Recorded: 05/28/2010Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/07/2010
Exec Dt:
03/07/2010
Assignee:
3333 COYOTE HILL ROAD
PALO ALTO, CALIFORNIA 94304
Correspondent:
EDWARD J. GRUNDLER
PARK, VAUGHAN & FLEMING, LLP
2820 FIFTH STREET
DAVIS, CA 95618
Assignment: 2
Reel/Frame:
026504/0804Recorded: 06/27/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/21/2011
Assignee:
500 ORACLE PARKWAY
MAIL STOP 5OP7
REDWOOD SHORES, CALIFORNIA 94065
Correspondent:
A. RICHARD PARK
PARK, VAUGHAN, FLEMING & DOWLER LLP
2820 FIFTH STREET
DAVIS, CA 95618

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