Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/25/2014
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Application #:
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13121018
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Filing Dt:
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06/07/2011
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Publication #:
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Pub Dt:
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09/22/2011
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Inventors:
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Ji Yun Kim, Hyun Sub Shin, Sung Won Lee, Hyung Eui Lee, Hyuk Soo Lee, Yeong Uk Seo et al
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Title:
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Structure for Multi-Row Lead Frame and Semiconductor Package Capable of Minimizing an Under-Cut
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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SEOUL SQUARE, 541, NAMDAEMUNNO 5-GA, JUNG-GU |
SEOUL, KOREA, REPUBLIC OF 100-714 |
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JEFF LLOYD |
P.O. BOX 142950 |
GAINESVILLE, FL 32614-2950 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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(705HO, SIHWA INDUSTRIAL COMPLEX 4 MA, SEONGGOK-DONG) 73, BEONNYEONG-RO, DANWON-GU, GYEONGGI-DO |
ANSAN-SI, KOREA, REPUBLIC OF 425-836 |
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CANTOR COLBURN LLP |
20 CHURCH STREET |
22ND FLOOR |
HARTFORD, CT 06103 |
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