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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8840830
Issue Dt:
09/23/2014
Application #:
13131961
Filing Dt:
05/31/2011
Publication #:
20110227239
Pub Dt:
09/22/2011
Inventors:
Shigeru Yamaki, Hideo Miyata, Nobuyuki Mitarai, Nobuaki Ishii, Katsumi Murofushi et al
Title:
METHOD OF MOLDING
Assignment: 1
Reel/Frame:
026369/0566Recorded: 06/01/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YAMAKI, SHIGERU
Exec Dt:
04/28/2011
MIYATA, HIDEO
Exec Dt:
04/27/2011
MITARAI, NOBUYUKI
Exec Dt:
05/10/2011
ISHII, NOBUAKI
Exec Dt:
04/27/2011
MUROFUSHI, KATSUMI
Exec Dt:
05/20/2011
YOSHIDA, KUNIO
Exec Dt:
04/28/2011
Assignees:
SHOWA DENKO K.K.
13-9, SHIBA DAIMON 1-CHOME
MINATO-KU, TOKYO, JAPAN 1058518
AJI CO., LTD.
2-1, SHINKOU 2-CHOME, NAKA-KU
YOKOHAMA-SHI, KANAGAWA, JAPAN 2310001
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVE, N.W.
SUITE 800
WASHINGTON, DC 20037
Assignment: 2
Reel/Frame:
031630/0253Recorded: 11/19/2013Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SHOWA DENKO K.K.
Exec Dt:
09/30/2013
Assignee:
AJI CO., LTD.
2-1, SHINKOU 2-CHOME, NAKA-KU
YOKOHAMA-SHI, KANAGAWA, JAPAN 231-0001
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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