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Patent Assignment Abstract of Title
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Total Assignments: 5
Patent #:
Issue Dt:
07/16/2013
Application #:
13074233
Filing Dt:
03/29/2011
Publication #:
Pub Dt:
09/29/2011
Inventor:
Shinji WAKISAKA
Title:
SEMICONDUCTOR STRUCTURE, MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
026041/0342Recorded: 03/29/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/15/2011
Assignee:
NO. 21-2, DOGENZAKA 1-CHOME, SHIBUYA-KU
TOKYO, JAPAN 150-0043
Correspondent:
HOLTZ, HOLTZ, GOODMAN & CHICK, PC
220 FIFTH AVENUE
NEW YORK, NY 10001-7708
Assignment: 2
Reel/Frame:
026297/0333Recorded: 05/18/2011Pages: 3
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNOR AND ASSIGNEE PREVIOUSLY RECORDED ON REEL 026041 FRAME 0342. ASSIGNOR(S) HEREBY CONFIRMS THE INCORRECT ASSIGNMENT WAS SUBMITTED..
Assignor:
Exec Dt:
02/16/2011
Assignee:
6-2, HON-MACHI 1 - CHOME,
SHIBUYA-KU,
TOKYO, JAPAN 151-8543
Correspondent:
HOLTZ, HOLTZ, GOODMAN & CHICK
220 5TH AVENUE
16TH FLOOR
NEW YORK, NY 10001-7708
Assignment: 3
Reel/Frame:
027342/0990Recorded: 12/07/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/15/2011
Assignee:
10-6, IMAI 3-CHOME, OME-SHI,
TOKYO,, JAPAN 198-8555
Correspondent:
LEONARD HOLTZ
220 FIFTH AVENUE
16TH FLOOR
NEW YORK, NY 10001
Assignment: 4
Reel/Frame:
041664/0471Recorded: 01/27/2017Pages: 17
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/09/2013
Assignee:
2-7-17, SHIN-YOKOHAMA
KOUHOKU-KU
YOKOHAMA-SHI, JAPAN
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 828
BRYANT E. WADE
BLOOMFIELD HILLS, MI 48303
Assignment: 5
Reel/Frame:
041521/0001Recorded: 01/27/2017Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/28/2016
Assignee:
455-1, KOHZAI-MINAMIMACHI
TAKAMATSU-SHI
KAGAWA, JAPAN 761-8014
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
P.O. BOX 828
BRYANT E. WADE
BLOOMFIELD HILLS, MI 48303

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