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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
03/20/2012
Application #:
12731793
Filing Dt:
03/25/2010
Publication #:
Pub Dt:
09/29/2011
Inventors:
Peter A. Gruber, Jae-woong Nah
Title:
WAFER LEVEL INTEGRATED INTERCONNECT DECAL AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
024146/0356Recorded: 03/26/2010Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/16/2010
Exec Dt:
03/15/2010
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
SCULLY, SCOTT, MURPHY & PRESSER, P.C.
400 GARDEN CITY PLAZA
SUITE 300
GARDEN CITY, NY 11530
Assignment: 2
Reel/Frame:
028867/0216Recorded: 08/29/2012Pages: 27
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/18/2012
Assignee:
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306
Assignment: 3
Reel/Frame:
051446/0476Recorded: 12/30/2019Pages: 19
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/19/2019
Assignee:
1 TERMINAL DRIVE
PLAINVIEW, NEW YORK 11803
Correspondent:
ALAN P KASS
394 ELIZABETH AVENUE
SOMERSET, NJ 08873

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