Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/23/2013
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Application #:
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13159368
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Filing Dt:
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06/13/2011
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Publication #:
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Pub Dt:
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10/06/2011
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Inventors:
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Mou-Shiung Lin, Shih-Hsiung Lin, Hsin-Jung Lo, Ying-Chih Chen, Chiu-Ming Chou
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Title:
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STACKED CHIP PACKAGE WITH REDISTRIBUTION LINES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ROOM 301/302, NO. 47, PARK 2ND RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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MCDERMOTT WILL & EMERY LLP |
18191 VON KARMAN AVENUE, SUITE 500 |
IRVINE, CA 92612-7108 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121-1714 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121 |
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QUALCOMM INCORPORATED |
5775 MOREHOUSE DRIVE |
SAN DIEGO, CA 92121 |
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