Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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04/15/2014
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Application #:
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13078391
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Filing Dt:
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04/01/2011
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Publication #:
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Pub Dt:
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10/06/2011
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Inventors:
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Bojko VODANOVIC, Jakov Kogan, Alexandr Filenkov, Marc Lévesque
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Title:
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WAFER FLATTENING APPARATUS AND METHOD
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Assignment:
1
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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| 19501 CLARK GRAHAM, SUITE 100 |
| BAIE D'URFE, QUEBEC, CANADA H9X 3T1 |
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| GOUDREAU GAGE DUBUC |
| 2000 MCGILL COLLEGE |
| SUITE 2200 |
| MONTREAL, H3A 3H3 CANADA |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 75-1, HASUNUMA-CHO ITABASHI-KU |
| TOKYO, JAPAN 174-8580 |
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| BUCHANAN, INGERSOLL & ROONEY |
| 1737 KING STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 TSUTSUMISOTO-CHO |
| NISHIKYOGOKU |
| UKYO-KU, KYOTO, JAPAN 615-0854 |
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| BROOKS KUSHMAN P.C. |
| 1000 TOWN CENTER |
| TWENTY-SECOND FLOOR |
| SOUTHFIELD, MI 48075 |
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