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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/17/2012
Application #:
13068821
Filing Dt:
05/20/2011
Publication #:
Pub Dt:
10/20/2011
Inventors:
Tony Chiang, Gongda Yao, Peijun Ding, Fusen E. Chen, Barry L. Chin, Gene Y. Kohara et al
Title:
METHOD OF DEPOSITING A UNIFORM BARRIER LAYER AND METAL SEED LAYER WITH REDUCED OVERHANG OVER A PLURALITY OF RECESSED SEMICONDUCTOR FEATURES
Assignment: 1
Reel/Frame:
027753/0619Recorded: 02/21/2012Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/25/1997
Exec Dt:
11/25/1997
Exec Dt:
11/25/1997
Exec Dt:
11/25/1997
Exec Dt:
11/25/1997
Exec Dt:
11/25/1997
Exec Dt:
12/01/1997
Exec Dt:
11/25/1997
Assignee:
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
SHIRLEY L. CHURCH, ESQ.
P.O. BOX 81146
SAN DIEGO, CALIFORNIA 92138

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