Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13144587
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Filing Dt:
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07/14/2011
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Publication #:
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Pub Dt:
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11/10/2011
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Inventors:
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Chung-Dam Song, Chang-Won Kim, Jung-Min Kim, Won-Taek Lee, Sung-Ho Park
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Title:
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MEMS MICROPHONE PACKAGE AND PACKAGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 58B 4L, 626-3 GOJAN-DONG, NAMDONG-GU |
| INCHEON, KOREA, REPUBLIC OF 405-817 |
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| RICHARD J. STREIT |
| LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
| CHICAGO, IL 60604 |
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