Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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06/11/2013
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Application #:
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12774811
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Filing Dt:
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05/06/2010
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Publication #:
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Pub Dt:
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11/10/2011
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Inventor:
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Wen-Hsiung CHANG
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Title:
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SEMICONDUCTOR DEVICE PACKAGING STRUCTURE AND PACKAGING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F, NO. 1, JINSHAN 8TH, |
| HSINCHU, TAIWAN 300 |
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| PORTAL IPR SERVICES |
| P.O. BOX 223205 |
| CHANTILLY, VA 20153 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| THE HALLMARK BUILDING, SUITE 227, OLD AIRPORT ROAD, |
| THE VALLEY, ANGUILLA |
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| LANWAY IPR SERVICES |
| P.O. BOX 220746 |
| CHANTILLY, VA 20153 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE RD |
| SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| PAUL S. HUNTER |
| FOLEY & LARDNER LLP |
| 150 E GILMAN STREET |
| MADISON, WI 53703 |
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Assignment:
4
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2711 CENTERVILLE RD |
| SUITE 400 |
| WILMINGTON, DELAWARE 19808 |
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| FOLEY & LARDNER LLP |
| 150 EAST GILMAN ST. |
| VEREX PLAZA |
| MADISON, WI 53703 |
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